Liquid bond coatingsf or barrier coatings

ABSTRACT

A coated component, along with methods of its formation and use, is provided. The coated component may include a substrate having a surface with a plurality of cavities defined therein, a bond coating (e.g., including a silicon material) on the surface of the substrate within the cavities, and an environmental barrier coating over the surface of the substrate and encasing the bond coating within the cavities such that the bond coating, when melted, is contained within the cavities. Such a coated component may be, in one embodiment, a turbine component, such as a CMC component for use in a hot gas path of a gas turbine engine.

FIELD

The present invention generally relates to bond coatings for use withenvironmental barrier coatings on ceramic components, along with methodsof their formation and use.

BACKGROUND

Higher operating temperatures for gas turbine engines are continuouslybeing sought in order to improve their efficiency. However, as operatingtemperatures increase, the high temperature durability of the componentsof the engine must correspondingly increase. Significant advances inhigh temperature capabilities have been achieved through the formulationof iron, nickel, and cobalt-based superalloys. Still, with many hot gaspath components constructed from super alloys, thermal barrier coatings(TBCs) can be utilized to insulate the components and can sustain anappreciable temperature difference between the load-bearing alloys andthe coating surface, thus limiting the thermal exposure of thestructural component.

While superalloys have found wide use for components used throughout gasturbine engines, and especially in the higher temperature sections,alternative lighter-weight substrate materials have been proposed, suchas ceramic matrix composite (CMC) materials. CMC and monolithic ceramiccomponents can be coated with environmental barrier coatings (EBCs) toprotect them from the harsh environment of high temperature enginesections. EBCs can provide a dense, hermetic seal against the corrosivegases in the hot combustion environment.

Silicon carbide and silicon nitride ceramics undergo oxidation in dry,high temperature environments. This oxidation produces a passive,silicon oxide scale on the surface of the material. In moist, hightemperature environments containing water vapor, such as a turbineengine, both oxidation and recession occurs due to the formation of apassive silicon oxide scale and subsequent conversion of the siliconoxide to gaseous silicon hydroxide. To prevent recession in moist, hightemperature environments, environmental barrier coatings (EBC's) aredeposited onto silicon carbide and silicon nitride materials.

Currently, EBC materials are made out of rare earth silicate compounds.These materials seal out water vapor, preventing it from reaching thesilicon oxide scale on the silicon carbide or silicon nitride surface,thereby preventing recession. Such materials cannot prevent oxygenpenetration, however, which results in oxidation of the underlyingsubstrate. Oxidation of the substrate yields a passive silicon oxidescale, along with the release of carbonaceous or nitrous oxide gas. Thecarbonaceous (i.e., CO, CO₂) or nitrous (i.e., NO, NO₂, etc.) oxidegases cannot escape out through the dense EBC and thus, blisters form.The use of a silicon bond coating has been the solution to thisblistering problem to date. The silicon bond coating provides a layerthat oxidizes (forming a passive silicon oxide layer beneath the EBC)without liberating a gaseous by-product.

However, the presence of a silicon bond coating limits the uppertemperature of operation for the EBC because the melting point ofsilicon metal is relatively low. In use, the silicon bond coating meltsat coating temperatures of about 1414° C., which is the melting point ofsilicon metal. Above these melting temperatures, the silicon bondcoating may delaminate from the underlying substrate, effectivelyremoving the bond coat and the EBC thereon. As such, it is desirable toimprove the properties of a silicon bond coating in the EBC to achieve ahigher operational temperature limit for the EBC.

BRIEF DESCRIPTION

Aspects and advantages of the invention will be set forth in part in thefollowing description, or may be obvious from the description, or may belearned through practice of the invention.

A coated component is generally provided, along with methods of itsformation and use. In one embodiment, the coated component includes asubstrate having a surface with a plurality of cavities defined therein,a bond coating (e.g., including a silicon material) on the surface ofthe substrate within the cavities, and an environmental barrier coatingover the surface of the substrate and encasing the bond coating withinthe cavities such that the bond coating, when melted, is containedwithin the cavities.

Such a coated component may be, in one embodiment, a turbine component,such as a CMC component for use in a hot gas path of a gas turbineengine.

Methods are also generally provided for forming a coated component. Inone embodiment, the method includes forming a plurality of cavitieswithin a surface of a substrate; forming a bond coating of a siliconmaterial within the cavities, and forming an environmental barriercoating over the surface of the substrate and encasing the bond coatingwithin the cavities such that the bond coating, when melted, iscontained within the cavities.

These and other features, aspects and advantages of the presentinvention will become better understood with reference to the followingdescription and appended claims. The accompanying drawings, which areincorporated in and constitute a part of this specification, illustrateembodiments of the invention and, together with the description, serveto explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

A full and enabling disclosure of the present invention, including thebest mode thereof, directed to one of ordinary skill in the art, is setforth in the specification, which makes reference to the appended Figs.,in which:

FIG. 1A is a cross-sectional side view of an exemplary coated componenthaving an encapsulated bond coating;

FIG. 1B is a cross-sectional side view of another exemplary coatedcomponent having an encapsulated bond coating;

FIG. 2A is an exploded cross-sectional side view of an exemplary coatedcomponent having an encapsulated bond coating, such as shown in FIG. 1A;

FIG. 2B is an exploded cross-sectional side view of another exemplarycoated component having an encapsulated bond coating, such as shown inFIG. 1B;

FIG. 3 is a top-down view of an exemplary substrate having anencapsulated bond coating, such as shown in FIGS. 1A, 1B, 2A and 2B;

FIG. 4 is a top-down view of another exemplary substrate having anencapsulated bond coating, such as shown in FIGS. 1A, 1B, 2A and 2B;

FIG. 5 is a schematic cross-sectional view of an exemplary gas turbineengine according to various embodiments of the present subject matter;and

FIG. 6 is a diagram of an exemplary method of forming a bond coatingwith a silicon-phase contained within a continuous phase of a refractoryphase.

Repeat use of reference characters in the present specification anddrawings is intended to represent the same or analogous features orelements of the present invention.

DETAILED DESCRIPTION

Reference now will be made in detail to embodiments of the invention,one or more examples of which are illustrated in the drawings. Eachexample is provided by way of explanation of the invention, notlimitation of the invention. In fact, it will be apparent to thoseskilled in the art that various modifications and variations can be madein the present invention without departing from the scope or spirit ofthe invention. For instance, features illustrated or described as partof one embodiment can be used with another embodiment to yield a stillfurther embodiment. Thus, it is intended that the present inventioncovers such modifications and variations as come within the scope of theappended claims and their equivalents.

As used herein, the terms “first”, “second”, and “third” may be usedinterchangeably to distinguish one component from another and are notintended to signify location or importance of the individual components.

In the present disclosure, when a layer is being described as “on” or“over” another layer or substrate, it is to be understood that thelayers can either be directly contacting each other or have anotherlayer or feature between the layers, unless expressly stated to thecontrary. Thus, these terms are simply describing the relative positionof the layers to each other and do not necessarily mean “on top of”since the relative position above or below depends upon the orientationof the device to the viewer.

A coated component is generally provided that includes a bond coatingpositioned within cavities defined within the surface of the substrateand under an environmental barrier coating (EBC) thereon. Generally, thebond coating is formed from a silicon material, such as silicon metal, asilicide having a relatively low melting point (e.g., 1500° C. or less),etc. As explained in greater detail below, the silicon material of thebond coating may melt during operation of the coated component, whileremaining contained within the cavities defined within the surface ofthe substrate by the EBC thereon. The bond coating may, in certainembodiments, retain its functions, such as bonding the substrate to theEBC thereon and gettering of oxygen without releasing gas to preventoxidation of the underlying substrate that would otherwise result in agaseous by-product. Thus, a liquid bond coating may be utilized duringoperation of the coating component (e.g., within a gas turbine engine).Since the bond coating continues to function above the melting point ofthe silicon material, the coated component can be operated attemperatures above the melting point of the silicon material.

Referring to FIGS. 1A, 1B, 2A and 2B, an exemplary coated component 100is shown formed from a substrate 102 having a surface 103 that defines aplurality of cavities 101 therein. Each of the cavities 101 contains abond coating 104, which may include a silicon material. In theembodiments shown in FIGS. 1A and 2A, the bond coating 104 is directlyon the surface 103 without any layer therebetween. However, in otherembodiments, one or more layers can be positioned between the bondcoating 104 and the surface 103. For example, FIGS. 1B and 2B show aboundary layer 120, as discussed in greater detail below, positionedbetween the bond coating 104 is directly on the surface 103 of thesubstrate 102.

In one particular embodiment, the silicon material of the bond coating104 may be formed from silicon metal, a silicon alloy (e.g., a siliconeutectic alloy), a silicide with a melting point of about 1500° C. orless, or mixtures thereof. The silicon material may exhibit good wettingwith the substrate 102 itself, or the substrate 102 may be chemicallymodified to promote wetting (e.g., by the inclusion of a boundary layer120 on the substrate 102). As such, the silicon material of the bondcoating 104 may melt at temperatures of about 1400° C. or greater,depending on the composition of the silicon material, so as to becomemolten. For example, the silicon material of the bond coating 104 mayhave at a melting temperature of about 1414° C. to about 1760° C. (e.g.,about 1414° C. to about 1485° C.). In particular embodiments, thesilicon material that is molten at a bond coating temperature of 1415°C., 1425° C., 1450° C., 1475° C., and/or 1500° C.

In particular embodiments, for example, the silicon material of the bondcoating 104 may include at least about 50% by weight of silicon metal,such as about 75% to 100% by weight of silicon metal. Pure silicon metalhas a melting point of about 1414° C. As such, the silicon material ofthe bond coating 104 may melt at temperatures of about 1414° C. orgreater, depending on the composition of the silicon material, so as tobecome molten.

In certain embodiments, a silicide having a melting point of about 1500°C. or less (e.g., about 1400° C. to about 1500° C.) may also be in thebond coating 104. Determining the melting point of a particular silicidemay be easily achieved using Si phase diagrams. Particularly suitablesilicides may include a rare earth and silicon so as to be compatiblewith the refractory material and/or the EBC material. For example,silicides having a melting point of about 1500° C. or less may include,in one particular embodiment, Si_(1-x)Y_(x) where x is greater than 0 toabout 0.25.

The adjacent cavities 101 may be separated from each other (i.e.,isolated from each other) with the surface 103 by ridges 106 having sidewalls 112 facing the cavity 101. As such, the walls 112 of the cavity101 work with the surface 103 of the substrate 102 and the environmentalbarrier coating 108 (and particularly a hermetic layer therein) tocontain the melted silicon material of the bond coating 104 thereinwhile keeping the integrity of the bond coating 104 without delaminationfrom the surface 103 of the substrate 102.

Generally, the bond coating 104 is relatively thin. In one particularembodiment, the bond coating 105 has a thickness that is equal to orless than the wall height of the wall 112 such that the bond coating 104does not extend out of the cavity 101. For example, the bond coating 105may have a thickness that is about 90% to 100% of the wall height of thewall 112 (e.g., about 95% to 100% of the wall height). In certainembodiments, the walls 112 may have a wall height that is about 25micrometers (μm) to about 275 μm, such as about 25 μm to about 150 μm(e.g., about 25 μm to about 100). Similarly, the bond coating 104 mayhave a thickness that is about 25 μm to about 275 μm, such as about 25μm to about 150 μm (e.g., about 25 μm to about 100).

As shown in FIGS. 2A and 2B, a bottom surface 113 within the cavity 101between opposing side walls 112 is defined by the substrate 102.Together with the overlying EBC 108, the side walls 112 and the bottomsurface 113 encapsulate the bond coating 104 such that, upon melting,the silicon material is contained within the cavity. In one embodiment,the bottom surface 113 may include a surface feature that increases thecontact surface area between the bond coating 104 and the substrate 102.For example, the bottom surface 113 may include a series of alternatingpeaks 115 and valleys 117. Similarly, the side walls 112 may includesuch surface features.

FIGS. 1B and 2B show an exemplary coated component 100 that includes aboundary layer 120 that inhibits interaction between the melted bondcoating 101 and the underlying substrate 102. For example, the boundarylayer 120 may be positioned between the silicon-based bond coating 101and the surface 113 of the substrate 102 within the cavities 101 suchthat, during operation at temperatures that melt the silicon material ofthe bond coating 104, the boundary layer 120 may protect the underlyingsubstrate 102 from reaction with the molten material (e.g., moltensilicon). For example, when Si metal is included within the bond coating104, a liquid Si metal may dissolve silicon carbide in the substrate102. Such an interaction between the liquid silicon material and thesubstrate may be inhibited through the presence of the boundary layer120. Generally, the boundary layer 120 is relatively thin so as to allowfor the silicon material of the bond coating 104 to at least partiallyperform its bonding function with the underlying substrate 102, whileremaining sufficiently thick to protect the substrate 102 from reactionwith molten silicon material during use at such temperatures. Inparticular embodiments, the boundary layer 120 may have a thickness thatis about 5 micrometers (μm) to about 100 μm, such as about 10 μm toabout 50 μm.

Generally, the boundary layer 120 includes a refractory material thathas a melting point that is greater than that of the silicon material ofthe bond coating 104 (e.g., about 1500° C. or greater) while beingcompatible with the material of the substrate 102 and while beingunreactive with the silicon material of the bond coating 104. In certainembodiments, the refractory material may wet the silicon material of thebond coating 104. For example, the refractory material of the boundarylayer 120 may include any suitable refractory material, including butnot limited to, rare earth silicates (e.g., rare earth disilicates, rareearth monosilicates, or mixtures thereof), rare earth gallium oxides,hafnium oxide, tantalum oxide, niobium oxide, silicides having a meltingpoint of about 1500° C. or greater (e.g., Mo₅Si₃, MoSi₂, ReSi₂, ReSi,WSi₂, W₅Si₃, CrSi₂, rare earth silicides, or mixtures thereof), siliconoxide, or mixtures thereof. In particular embodiments, the refractorymaterial of the boundary layer 120 may be doped with boron, gallium,aluminum, or another dopant.

As shown in FIGS. 3-4, the ridges 106 may form a pattern, such as acontinuous pattern on the surface (e.g., a square grid shown in FIG. 3or a diamond grid shown in FIG. 4), which may have any desired shapeover the surface 103 of the substrate 102. In particular embodiments,the pattern may cover the entire surface 103 of the substrate 102,particularly when the surface 103 faces a hot gas path on an enginecomponent.

No matter the particular pattern formed by the ridges 106, a greatmajority of the surface area of the surface 103 on the substrate 102 isdefined by the cavities 106, while the ridges 106 define a relativelysmall portion of the surface area of the surface 103. Thus, the bondcoating 104 may contact a great majority of the inner surface of theoverlying EBC 108, with only a small amount of the surface 103 beingbonded directly to the EBC 108 without any bond material therebetween.However, the ridges 106 provide a sufficient surface area for bonding tothe inner surface of the EBC 108 when the material of the bond coating104 is melted. For example, the cavities may define about 90% to lessthan 100% of the total surface area of the surface 103 on the substrate102, such as about 95% to less than 100% (e.g., about 98% to less than100%). Conversely, the ridges 106 may define greater than 0% to about10% of the total surface area of the surface 103 on the substrate 102,such as greater than 0% to about 5% (e.g., greater than 0% to about 2%).

In certain embodiments, the ridges 106 may have a width of about 10 μmμm to about 3 millimeter (mm) to provide a sufficient surface area tobond with the overlying EBC 108 while remaining thin enough such thatblistering (e.g., through oxidation of the underlying substrate 102)does not occur in a detrimental amount.

FIGS. 1 and 2 show a thermally grown oxide (“TGO”) layer 105, which mayform on the surface of the bond coating 104, such as a layer of siliconoxide (sometimes referred to as “silicon oxide scale” or “silicascale”), during exposure to oxygen (e.g., during manufacturing and/oruse) of the component 100. In one embodiment, at least a portion of theridges 106 may bond directly to the surface 103 of the substrate 102without any other layer therebetween. However, in alternativeembodiments, the ridges 106 may have a width that is small enough toallow the TGO layer 105 to migrate and extend over the ridge 106 betweenadjacent bond coatings 104.

As stated above, the bond coating 104 may be used in conjunction with anEBC 108 to form a coated component 100 with an increased operatingtemperature compared to that using a uniformly applied silicon bondcoating (without the cavities 101). The EBC 108 may include anycombination of one or more layers formed from materials selected fromtypical EBC or thermal barrier coating (“TBC”) layer chemistries,including but not limited to rare earth silicates (e.g., mono-silicatesand di-silicates), aluminosilicates (e.g., mullite, barium strontiumaluminosilicate (BSAS), rare earth aluminosilicates, etc.), hafnia,zirconia, stabilized hafnia, stabilized zirconia, rare earth hafnates,rare earth zirconates, rare earth gallium oxide, etc.

The EBC 108 may be formed from a plurality of individual layers 114. Inthe embodiment shown in FIGS. 2A and 2B, EBC 108 includes a hermeticlayer 116 positioned in directly on the bond coating 104 so as to encasethe silicon material, upon melting, within the cavity 101. However, inother embodiments, the hermetic layer 116 may be positioned elsewherewithin the EBC 108.

Referring FIGS. 1 and 2, the substrate 102 may be formed from a ceramicmatrix composite (“CMC”) material, such as a silicon based, non-oxideceramic matrix composite. As used herein, “CMC” refers to asilicon-containing, or oxide-oxide, matrix and reinforcing material. Asused herein, “monolithic ceramics” refers to materials without fiberreinforcement (e.g., having the matrix material only). Herein, CMCs andmonolithic ceramics are collectively referred to as “ceramics.”

Some examples of CMCs acceptable for use herein can include, but are notlimited to, materials having a matrix and reinforcing fibers comprisingnon-oxide silicon-based materials such as silicon carbide, siliconnitride, silicon oxycarbides, silicon oxynitrides, and mixtures thereof.Examples include, but are not limited to, CMCs with silicon carbidematrix and silicon carbide fiber; silicon nitride matrix and siliconcarbide fiber; and silicon carbide/silicon nitride matrix mixture andsilicon carbide fiber. Furthermore, CMCs can have a matrix andreinforcing fibers comprised of oxide ceramics. Specifically, theoxide-oxide CMCs may be comprised of a matrix and reinforcing fiberscomprising oxide-based materials such as aluminum oxide (Al₂O₃), silicondioxide (SiO₂), aluminosilicates, and mixtures thereof. Aluminosilicatescan include crystalline materials such as mullite (3Al₂O₃ 2SiO₂), aswell as glassy aluminosilicates.

The coated component 100 is particularly suitable for use as a componentfound in high temperature environments, such as those present in gasturbine engines, for example, combustor components, turbine blades,shrouds, nozzles, heat shields, and vanes. In particular, the turbinecomponent can be a CMC component positioned within a hot gas flow pathof the gas turbine such that the coating system (with the bond coating104 and the EBC 108) forms an environmental barrier for the underlyingsubstrate 102 to protect the component 100 within the gas turbine whenexposed to the hot gas flow path.

FIG. 5 is a schematic cross-sectional view of a gas turbine engine inaccordance with an exemplary embodiment of the present disclosure. Moreparticularly, for the embodiment of FIG. 5, the gas turbine engine is ahigh-bypass turbofan jet engine 10, referred to herein as “turbofanengine 10.” As shown in FIG. 5, the turbofan engine 10 defines an axialdirection A (extending parallel to a longitudinal centerline 12 providedfor reference) and a radial direction R. In general, the turbofan 10includes a fan section 14 and a core turbine engine 16 disposeddownstream from the fan section 14. Although described below withreference to a turbofan engine 10, the present disclosure is applicableto turbomachinery in general, including turbojet, turboprop andturboshaft gas turbine engines, including industrial and marine gasturbine engines and auxiliary power units.

The exemplary core turbine engine 16 depicted generally includes asubstantially tubular outer casing 18 that defines an annular inlet 20.The outer casing 18 encases, in serial flow relationship, a compressorsection including a booster or low pressure (LP) compressor 22 and ahigh pressure (HP) compressor 24; a combustion section 26; a turbinesection including a high pressure (HP) turbine 28 and a low pressure(LP) turbine 30; and a jet exhaust nozzle section 32. A high pressure(HP) shaft or spool 34 drivingly connects the HP turbine 28 to the HPcompressor 24. A low pressure (LP) shaft or spool 36 drivingly connectsthe LP turbine 30 to the LP compressor 22.

For the embodiment depicted, the fan section 14 includes a variablepitch fan 38 having a plurality of fan blades 40 coupled to a disk 42 ina spaced apart manner. As depicted, the fan blades 40 extend outwardlyfrom disk 42 generally along the radial direction R. Each fan blade 40is rotatable relative to the disk 42 about a pitch axis P by virtue ofthe fan blades 40 being operatively coupled to a suitable actuationmember 44 configured to collectively vary the pitch of the fan blades 40in unison. The fan blades 40, disk 42, and actuation member 44 aretogether rotatable about the longitudinal axis 12 by LP shaft 36 acrossan optional power gear box 46. The power gear box 46 includes aplurality of gears for stepping down the rotational speed of the LPshaft 36 to a more efficient rotational fan speed.

Referring still to the exemplary embodiment of FIG. 5, the disk 42 iscovered by rotatable front nacelle 48 aerodynamically contoured topromote an airflow through the plurality of fan blades 40. Additionally,the exemplary fan section 14 includes an annular fan casing or outernacelle 50 that circumferentially surrounds the fan 38 and/or at least aportion of the core turbine engine 16. It should be appreciated that thenacelle 50 may be configured to be supported relative to the coreturbine engine 16 by a plurality of circumferentially-spaced outletguide vanes 52. Moreover, a downstream section 54 of the nacelle 50 mayextend over an outer portion of the core turbine engine 16 so as todefine a bypass airflow passage 56 therebetween.

During operation of the turbofan engine 10, a volume of air 58 entersthe turbofan 10 through an associated inlet 60 of the nacelle 50 and/orfan section 14. As the volume of air 58 passes across the fan blades 40,a first portion of the air 58 as indicated by arrows 62 is directed orrouted into the bypass airflow passage 56 and a second portion of theair 58 as indicated by arrow 64 is directed or routed into the LPcompressor 22. The ratio between the first portion of air 62 and thesecond portion of air 64 is commonly known as a bypass ratio. Thepressure of the second portion of air 64 is then increased as it isrouted through the high pressure (HP) compressor 24 and into thecombustion section 26, where it is mixed with fuel and burned to providecombustion gases 66.

The combustion gases 66 are routed through the HP turbine 28 where aportion of thermal and/or kinetic energy from the combustion gases 66 isextracted via sequential stages of HP turbine stator vanes 68 that arecoupled to the outer casing 18 and HP turbine rotor blades 70 that arecoupled to the HP shaft or spool 34, thus causing the HP shaft or spool34 to rotate, thereby supporting operation of the HP compressor 24. Thecombustion gases 66 are then routed through the LP turbine 30 where asecond portion of thermal and kinetic energy is extracted from thecombustion gases 66 via sequential stages of LP turbine stator vanes 72that are coupled to the outer casing 18 and LP turbine rotor blades 74that are coupled to the LP shaft or spool 36, thus causing the LP shaftor spool 36 to rotate, thereby supporting operation of the LP compressor22 and/or rotation of the fan 38.

The combustion gases 66 are subsequently routed through the jet exhaustnozzle section 32 of the core turbine engine 16 to provide propulsivethrust. Simultaneously, the pressure of the first portion of air 62 issubstantially increased as the first portion of air 62 is routed throughthe bypass airflow passage 56 before it is exhausted from a fan nozzleexhaust section 76 of the turbofan 10, also providing propulsive thrust.The HP turbine 28, the LP turbine 30, and the jet exhaust nozzle section32 at least partially define a hot gas path 78 for routing thecombustion gases 66 through the core turbine engine 16.

Methods are also generally provided for coating a ceramic component. Forexample, FIG. 6 shows a diagram of an exemplary method 600 of forming acoating system on a surface of a substrate. At 602, a plurality ofcavities are formed within a surface of the substrate. At 604, a bondcoating is formed within the cavities of the substrate, and may includea silicon material (e.g., silicon metal). At 606, an environmentalbarrier coating (EBC) is formed over the surface of the substrate toencase the bond coating within the cavities. As described above, thebond coating, when melted, is contained within cavities between thesubstrate and an inner surface of the environmental barrier coating.

This written description uses examples to disclose the invention,including the best mode, and also to enable any person skilled in theart to practice the invention, including making and using any devices orsystems and performing any incorporated methods. The patentable scope ofthe invention is defined by the claims, and may include other examplesthat occur to those skilled in the art. Such other examples are intendedto be within the scope of the claims if they include structural elementsthat do not differ from the literal language of the claims, or if theyinclude equivalent structural elements with insubstantial differencesfrom the literal languages of the claims.

What is claimed is:
 1. A coated component comprising: a substrate having a surface, wherein a plurality of cavities are defined within the surface of the substrate; a bond coating on the surface of the substrate within the cavities defined within the surface of the substrate, wherein the bond coating comprises a silicon material having a melting point; and an environmental barrier coating over the surface of the substrate and encasing the bond coating within the cavities such that the bond coating, when melted, is contained within the cavities.
 2. The coated component as in claim 1, wherein the bond coating comprises silicon metal, a silicon alloy, a silicide with a melting point of about 1500° C. or less, or mixtures thereof.
 3. The coated component as in claim 1, wherein the bond coating melts at temperatures of about 1400° C. or greater.
 4. The coated component as in claim 1, wherein each cavity is defined by a plurality of side walls, each side wall having a wall height, and wherein the bond coating has a thickness that is equal to or less than the wall height.
 5. The coated component as in claim 4, wherein a bottom surface within the cavity and between opposing side walls, wherein at least one of the side walls and the bottom surface includes a series of alternating peaks and valleys to increase the contact surface area between the bond coating and the substrate.
 6. The coated component as in claim 4, wherein a bottom surface is defined by the substrate within the cavity and between opposing side walls, wherein the bottom surface includes a series of peaks and valleys to increase the contact surface area between the bond coating and the substrate.
 7. The coated component as in claim 4, wherein the bond coating has a thickness that is about 90% to 100% of the wall height.
 8. The coated component as in claim 4, wherein the wall height that is about 25 micrometers (μm) to about 275 μm, and wherein the bond coating has a thickness that is about 25 μm to about 275 μm.
 9. The coated component as in claim 4, further comprising: a boundary layer extending over a bottom surface defined by the substrate within the cavity and between opposing side walls such that the boundary layer is between the bond coating and the substrate.
 10. The coated component as in claim 9, wherein the boundary layer comprises a rare earth silicate, a rare earth gallium oxide, hafnium oxide, tantalum oxide, niobium oxide, a silicide having a melting point of about 1500° C. or greater, silicon oxide, or mixtures thereof.
 11. The coated component as in claim 9, wherein the boundary layer has a thickness that is about 5 μm to about 100 μm.
 12. The coated component as in claim 1, wherein adjacent cavities are separated from each other by ridges on the surface of the substrate.
 13. The coated component as in claim 12, wherein a plurality of ridges defines a pattern on the surface of the substrate.
 14. The coated component as in claim 12, wherein the surface of the substrate has a surface area, and wherein the ridges define greater than 0% to about 10% of the surface area of the substrate.
 15. The coated component as in claim 12, wherein the surface of the substrate has a surface area, and wherein the ridges define greater than 0% to about 5% of the surface area of the substrate.
 16. The coated component as in claim 1, wherein the ridges have a width of about 10 μm to about 3 mm.
 17. The coated component as in claim 1, wherein the environmental barrier coating comprises a plurality of layers with at least one of the layers of the environmental barrier coating comprises a hermetic layer, and wherein the hermetic layer is adjacent to the bond coating such that the hermetic layer defines the inner surface of the environmental barrier coating.
 18. The coated component as in claim 1, wherein the substrate comprises a ceramic matrix composite (CMC) comprising silicon carbide, silicon nitride, or a combination thereof, and wherein the substrate comprises a plurality of CMC plies.
 19. A turbine component, comprising: a substrate comprising a ceramic matrix composite and having a surface, wherein a plurality of cavities are defined within the surface of the substrate; a bond coating on the surface of the substrate within the cavities defined within the surface of the substrate, wherein the bond coating comprises a silicon material having a melting point that is less than a melting point of the ceramic matrix composite; and an environmental barrier coating over the surface of the substrate and encasing the bond coating within the cavities such that the bond coating, when melted, is contained within the cavities.
 20. A method of forming a coated component, the method comprising: forming a plurality of cavities within a surface of a substrate; forming a bond coating within the cavities, wherein the bond coating comprises a silicon material having a melting point; and forming an environmental barrier coating over the surface of the substrate and encasing the bond coating within the cavities such that the bond coating, when melted, is contained within the cavities. 